• DocumentCode
    1944854
  • Title

    3D stacked transmitter and receiver chips for high bandwidth density optical interconnects

  • Author

    Duan, Pinxiang ; Raz, Oded ; Smalbrugge, B.E. ; van de Plassche, K.L. ; Dorrestein, S. ; Duis, Jeroen ; Dorren, H.J.S.

  • Author_Institution
    COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
  • fYear
    2013
  • fDate
    22-26 Sept. 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A receiver chip based on 3D stacking a photodiode chip directly on top of TIA CMOS IC is demonstrated. Open eye patterns are demonstrated for both 3D stacked receiver and transmitter chips and BER measurements of the transmitter show penalty free operation under uniform biasing conditions proving that the interconnecting technology is robust.
  • Keywords
    CMOS integrated circuits; error statistics; optical interconnections; photodiodes; receivers; three-dimensional integrated circuits; transmitters; 3D stacked receiver chips; 3D stacked transmitter chips; 3D stacking; BER measurements; TIA CMOS IC; high bandwidth density optical interconnects; interconnecting technology; photodiode chip; uniform biasing conditions;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Optical Communication (ECOC 2013), 39th European Conference and Exhibition on
  • Conference_Location
    London
  • Electronic_ISBN
    978-1-84919-759-5
  • Type

    conf

  • DOI
    10.1049/cp.2013.1577
  • Filename
    6647770
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1944854