Title :
3D stacked transmitter and receiver chips for high bandwidth density optical interconnects
Author :
Duan, Pinxiang ; Raz, Oded ; Smalbrugge, B.E. ; van de Plassche, K.L. ; Dorrestein, S. ; Duis, Jeroen ; Dorren, H.J.S.
Author_Institution :
COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
Abstract :
A receiver chip based on 3D stacking a photodiode chip directly on top of TIA CMOS IC is demonstrated. Open eye patterns are demonstrated for both 3D stacked receiver and transmitter chips and BER measurements of the transmitter show penalty free operation under uniform biasing conditions proving that the interconnecting technology is robust.
Keywords :
CMOS integrated circuits; error statistics; optical interconnections; photodiodes; receivers; three-dimensional integrated circuits; transmitters; 3D stacked receiver chips; 3D stacked transmitter chips; 3D stacking; BER measurements; TIA CMOS IC; high bandwidth density optical interconnects; interconnecting technology; photodiode chip; uniform biasing conditions;
Conference_Titel :
Optical Communication (ECOC 2013), 39th European Conference and Exhibition on
Conference_Location :
London
Electronic_ISBN :
978-1-84919-759-5
DOI :
10.1049/cp.2013.1577
