Title :
Glass Reflow Modeling for Process Optimization
Author :
Tissier, A. ; Poncet, A. ; Teissier, J.F.
Author_Institution :
CNET-Grenoble - France
Keywords :
Glass; Numerical analysis; Numerical simulation; Semiconductor device modeling; Simulated annealing; Slabs; Temperature measurement; Testing; Time measurement; Viscosity;
Conference_Titel :
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location :
Bologna, Italy