• DocumentCode
    1944975
  • Title

    Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

  • Author

    Schroder, Henning ; Arndt-Staufenbiel, Norbert ; Beier, Axel ; Ebling, Frank ; Franke, Martin ; Griese, Elmar ; Intemann, Steffan ; Kostelnik, Jan ; Kuhler, Thomas ; Modinger, Roland ; Roda, Ingo ; Schlosser, Ingolf

  • Author_Institution
    Fraunhofer IZM, Berlin
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    268
  • Lastpage
    275
  • Abstract
    The concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented. An ion-exchange process was developed to manufacture the graded index waveguides in thin-glass sheets. Besides of their excellent optical properties no mechanical structuring is necessary for the waveguides. Their properties were simulated and experimentally validated. The circuit board assembly is presented, as well as the concept developed for the optical coupling in the module-to-board and board-to- backplane coupling, and the assembly of the pluggable electrical-optical module itself is described.
  • Keywords
    ion exchange; matrix algebra; optical couplers; optical glass; optical waveguides; printed circuits; board-to-backplane coupling; electrical-optical module; graded-index multimode waveguides; ion-exchange technology; optical coupling; thin glass based electrical-optical circuit boards; thin-glass sheets; Assembly; Backplanes; Circuit simulation; Displays; Glass manufacturing; Manufacturing processes; Mechanical factors; Optical coupling; Optical waveguides; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4549981
  • Filename
    4549981