DocumentCode
1945066
Title
Overview of Modeling Approaches for Scaled Non Volatile Memories
Author
Ielmini, Daniele
Author_Institution
Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
fYear
2009
fDate
9-11 Sept. 2009
Firstpage
1
Lastpage
8
Abstract
The success of non-volatile memory (NVM) in the last two decades have relied on the relentless downscaling of MOS-based Flash devices. Entering the 2X nm technology, the physical scaling of Flash memories will have to face potential reliability and feasibility showstoppers. To understand the ultimate scaling limits of the Flash technology and to evaluate alternative memory concepts, physically-based models able to describe small-size effects and non-silicon-based materials are required. This work reviews recent developments and open issues of Flash and postFlash modeling, discussing physical mechanisms in reliability and operation and highlighting the challenges in the understanding of non-silicon active materials for phase change memory (PCM) and resistive-switching memory (RRAM) devices.
Keywords
flash memories; phase change memories; MOS-based flash devices; flash memories; nonsilicon-based materials; phase change memory; resistive-switching memory devices; scaled nonvolatile memories; ultimate scaling limits; Driver circuits; Electrothermal effects; Error correction codes; Flash memory; Hot carrier injection; Materials reliability; Nonvolatile memory; Phase change materials; Phase change memory; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location
San Diego, CA
ISSN
1946-1569
Print_ISBN
978-1-4244-3974-8
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2009.5290262
Filename
5290262
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