• DocumentCode
    1945066
  • Title

    Overview of Modeling Approaches for Scaled Non Volatile Memories

  • Author

    Ielmini, Daniele

  • Author_Institution
    Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
  • fYear
    2009
  • fDate
    9-11 Sept. 2009
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The success of non-volatile memory (NVM) in the last two decades have relied on the relentless downscaling of MOS-based Flash devices. Entering the 2X nm technology, the physical scaling of Flash memories will have to face potential reliability and feasibility showstoppers. To understand the ultimate scaling limits of the Flash technology and to evaluate alternative memory concepts, physically-based models able to describe small-size effects and non-silicon-based materials are required. This work reviews recent developments and open issues of Flash and postFlash modeling, discussing physical mechanisms in reliability and operation and highlighting the challenges in the understanding of non-silicon active materials for phase change memory (PCM) and resistive-switching memory (RRAM) devices.
  • Keywords
    flash memories; phase change memories; MOS-based flash devices; flash memories; nonsilicon-based materials; phase change memory; resistive-switching memory devices; scaled nonvolatile memories; ultimate scaling limits; Driver circuits; Electrothermal effects; Error correction codes; Flash memory; Hot carrier injection; Materials reliability; Nonvolatile memory; Phase change materials; Phase change memory; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-3974-8
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2009.5290262
  • Filename
    5290262