DocumentCode :
1945430
Title :
Manufacturability and reliability of a high-speed CSP SRAM on an interposer package
Author :
Liu, Kuo Chuan ; Priest, Judy ; Xue, Jie ; Lin, Jarsh ; Kao, Chin Li ; Wang, Tong Hong ; Lai, Yi Shao
Author_Institution :
Cisco Syst., Inc., San Jose, CA
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
374
Lastpage :
381
Abstract :
Manufacturability and reliability of a custom CSP SRAM mounted on an interposer is discussed in this paper. In order to provide a reliable device for high reliability applications, an SRAM interposer structure was designed to ensure high reliability on every level of solder joint interconnects. Finite element modeling method was used as a mean to evaluate the reliability of various configurations of the protection methods. Test vehicles were built to run reliability tests on selected configurations from FEA simulation to evaluate the integrity and robustness of the SRAM interposer. An under fill process was chosen to be the protection method in production because of its reliability performance. However, extra efforts are needed for implementation during production in order to address the manufacturability concern.
Keywords :
SRAM chips; ball grid arrays; finite element analysis; flip-chip devices; semiconductor device reliability; capacity memory package; finite element modeling method; high-performance flip-chip ball grid array; high-speed CSP SRAM; interposer package; solder joint interconnects; Chip scale packaging; Finite element methods; Production; Protection; Pulp manufacturing; Random access memory; Robustness; Soldering; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4549999
Filename :
4549999
Link To Document :
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