Ball semiconductor technology and its application to MEMS

Author

Takeda, Nobuo

Author_Institution

Ball Semicond. Ltd., Japan

fYear

2000

fDate

23-27 Jan 2000

Firstpage

11

Lastpage

16

Abstract

This paper describes Ball semiconductor technology that realizes integrated circuits and other devices on 1-milimeter sphere. Single crystallization, no-contact processing, spherical lithography, 3D VLSI design and VLSI by clustering are five key enabling technologies of the Ball semiconductor. Three major product categories of the Ball, integrated circuits, RF applications and MEMS (Micro Electro Mechanical System), are described here. Especially electro-statically levitated 3-axis accelerometer is mentioned as an application of Ball semiconductor technology to MEMS

Keywords

micromechanical devices; semiconductor technology; 3D VLSI design; Ball semiconductor technology; MEMS system; RF system; clustering; electrostatic levitation; integrated circuit; noncontact processing; single crystallization; spherical lithography; three-axis accelerometer; Accelerometers; Application specific integrated circuits; Crystallization; Integrated circuit technology; Lithography; Mechanical systems; Micromechanical devices; Radio frequency; Radiofrequency integrated circuits; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838482

Filename

838482