Title :
Ball semiconductor technology and its application to MEMS
Author_Institution :
Ball Semicond. Ltd., Japan
Abstract :
This paper describes Ball semiconductor technology that realizes integrated circuits and other devices on 1-milimeter sphere. Single crystallization, no-contact processing, spherical lithography, 3D VLSI design and VLSI by clustering are five key enabling technologies of the Ball semiconductor. Three major product categories of the Ball, integrated circuits, RF applications and MEMS (Micro Electro Mechanical System), are described here. Especially electro-statically levitated 3-axis accelerometer is mentioned as an application of Ball semiconductor technology to MEMS
Keywords :
micromechanical devices; semiconductor technology; 3D VLSI design; Ball semiconductor technology; MEMS system; RF system; clustering; electrostatic levitation; integrated circuit; noncontact processing; single crystallization; spherical lithography; three-axis accelerometer; Accelerometers; Application specific integrated circuits; Crystallization; Integrated circuit technology; Lithography; Mechanical systems; Micromechanical devices; Radio frequency; Radiofrequency integrated circuits; Very large scale integration;
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
Print_ISBN :
0-7803-5273-4
DOI :
10.1109/MEMSYS.2000.838482
