DocumentCode :
1945771
Title :
Migration of Fluorine Atoms and Influence on Shallow P* N Junction in BF*2 Implanted Silicon under RTA
Author :
Zhang, T.-Q. ; Liu, J.-L. ; Yang, X.-Y.
Author_Institution :
Microelectronics Research Institute, Xidian University, Xi´´an, China
fYear :
1988
fDate :
13-16 Sept. 1988
Abstract :
The migration of fluorine atoms in BF+2 implanted silicon under RTA has been analysed using SIMS, the microstructural defect of BF+2 implanted silicon before and after RTA has been observed using TEM, and the reverse leakage current of BF+2 implanted diodes after RTA has been measured. The results show that the amorphous layer and the damaged crystalline region strongly influence fluorine redistribution during RTA, but the anomalous migration of fluorine atoms has no measurable influence on the electrical properties of shallow P+N junction.
Keywords :
Amorphous materials; Annealing; Atomic layer deposition; Atomic measurements; Crystallization; Current measurement; Diodes; Leakage current; Silicon; Time of arrival estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1988. ESSDERC '88. 18th European
Conference_Location :
Montpellier, France
Print_ISBN :
2868830994
Type :
conf
Filename :
5436962
Link To Document :
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