DocumentCode
1945771
Title
Migration of Fluorine Atoms and Influence on Shallow P* N Junction in BF*2 Implanted Silicon under RTA
Author
Zhang, T.-Q. ; Liu, J.-L. ; Yang, X.-Y.
Author_Institution
Microelectronics Research Institute, Xidian University, Xi´´an, China
fYear
1988
fDate
13-16 Sept. 1988
Abstract
The migration of fluorine atoms in BF+2 implanted silicon under RTA has been analysed using SIMS, the microstructural defect of BF+2 implanted silicon before and after RTA has been observed using TEM, and the reverse leakage current of BF+2 implanted diodes after RTA has been measured. The results show that the amorphous layer and the damaged crystalline region strongly influence fluorine redistribution during RTA, but the anomalous migration of fluorine atoms has no measurable influence on the electrical properties of shallow P+N junction.
Keywords
Amorphous materials; Annealing; Atomic layer deposition; Atomic measurements; Crystallization; Current measurement; Diodes; Leakage current; Silicon; Time of arrival estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1988. ESSDERC '88. 18th European
Conference_Location
Montpellier, France
Print_ISBN
2868830994
Type
conf
Filename
5436962
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