DocumentCode :
1945890
Title :
System performance comparisons of coreless and standard packages for data rate beyond 20 Gbps
Author :
Beyene, Wendemagegnehu T. ; Schmitt, Ralf ; Shi, Hao ; Feng, June
Author_Institution :
Rambus Inc., Los Altos, CA
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
526
Lastpage :
532
Abstract :
This paper analyzes the impact of standard and coreless packages on the overall high-speed system performance for data rate beyond 20 Gbps. Instead of focusing on package electrical performance in isolation, we study the package impact on the system performance metrics such as voltage and timing margins and bit error rate (BER) bathtub curves in both time and voltage by employing statistical system simulation methods. Furthermore, the package impact on the quality of the power supply network is also studied using conventional frequency and time domain simulation techniques. Finally, three designs with standard and coreless packages are analyzed to compare the package impacts on signal integrity and power integrity of high-speed systems.
Keywords :
error statistics; frequency-domain analysis; power supply quality; time-domain analysis; BER; bit error rate; coreless packages; frequency domain simulation techniques; high-speed system performance; package electrical performance; power integrity; power supply network quality; signal integrity; statistical system simulation methods; system performance comparisons; time domain simulation techniques; voltage-timing margins; Bit error rate; Electronics packaging; Frequency; Impedance; Performance analysis; Signal analysis; System performance; Timing; Variable structure systems; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4550023
Filename :
4550023
Link To Document :
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