Title :
A modular segmentation approach for comprehensive electromagnetic modeling of the power distribution network
Author :
Kollia, Varvara ; Cangellaris, Andreas C.
Author_Institution :
ECE Dept., Univ. of Illinois, Urbana, IL
Abstract :
The accurate electromagnetic modeling of the power distribution network at the board level is critical for today´s digital applications. In this work, we propose a modular approach for board power distribution network design. The proposed approach relies on the decomposition of the board metallization layers into parallel-plate polygons and the various geometric discontinuities introduced by vias, slots and splits in metallization planes, and the edges of the board. Electromagnetic models for the various segments are generated a-priori and are brought together in a physically consistent manner to yield a compact model for the board that lends itself to an expedient numerical solution toward the generation of a SPICE-compatible, broadband, frequency-dependent multi-port network. Numerical studies are presented that validate the proposed methodology and demonstrate its attributes.
Keywords :
SPICE; distribution networks; integrated circuit metallisation; integrated circuit modelling; multiport networks; SPICE; board metallization; board power distribution network design; electromagnetic modeling; geometric discontinuity; multiport network; parallel-plate polygon; Circuit synthesis; Design automation; Digital circuits; Electromagnetic modeling; Frequency; Integral equations; Metallization; Pins; Power systems; Printed circuits;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550039