• DocumentCode
    1946200
  • Title

    A modular segmentation approach for comprehensive electromagnetic modeling of the power distribution network

  • Author

    Kollia, Varvara ; Cangellaris, Andreas C.

  • Author_Institution
    ECE Dept., Univ. of Illinois, Urbana, IL
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    638
  • Lastpage
    645
  • Abstract
    The accurate electromagnetic modeling of the power distribution network at the board level is critical for today´s digital applications. In this work, we propose a modular approach for board power distribution network design. The proposed approach relies on the decomposition of the board metallization layers into parallel-plate polygons and the various geometric discontinuities introduced by vias, slots and splits in metallization planes, and the edges of the board. Electromagnetic models for the various segments are generated a-priori and are brought together in a physically consistent manner to yield a compact model for the board that lends itself to an expedient numerical solution toward the generation of a SPICE-compatible, broadband, frequency-dependent multi-port network. Numerical studies are presented that validate the proposed methodology and demonstrate its attributes.
  • Keywords
    SPICE; distribution networks; integrated circuit metallisation; integrated circuit modelling; multiport networks; SPICE; board metallization; board power distribution network design; electromagnetic modeling; geometric discontinuity; multiport network; parallel-plate polygon; Circuit synthesis; Design automation; Digital circuits; Electromagnetic modeling; Frequency; Integral equations; Metallization; Pins; Power systems; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550039
  • Filename
    4550039