• DocumentCode
    1946271
  • Title

    Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects

  • Author

    Choi, Yongjin ; Braunisch, Henning ; Aygun, Kemal ; Franzon, Paul D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    664
  • Lastpage
    668
  • Abstract
    While the increasing demand for smaller packages and low-cost platforms aggressively drives the interconnect density per unit area, crosstalk noise due to capacitive and inductive coupling limits the achievable interconnect density. As an alternative, we investigate multimode signaling where n signals are transmitted by exciting all fundamental modes on a group of n closely coupled lines called a bundle. Even though crosstalk is ideally zero in a single bundle, practical implementation of this idea for a typical input/output (IO) bus requires multiple closely-placed bundles. Thus, inter-bundle crosstalk may be an issue. In this paper, we analyze the inter-bundle crosstalk starting with the analytical expressions for the modal conversion from one bundle to another. Frequency domain simulations for both frequency-dependent and frequency-independent terminations are performed to compare performance vs. density benefits of multi-bundle multi-mode interconnects to those provided by conventional single-ended and differential signaling.
  • Keywords
    crosstalk; multiprocessor interconnection networks; signalling; crosstalk noise; frequency-dependent terminations; frequency-independent terminations; high-density interconnects; inductive coupling limits; input-output bus; interbundle crosstalk; modal conversion; multimode signaling; Bandwidth; Capacitance; Crosstalk; Decoding; Frequency domain analysis; Microprocessors; Multicore processing; Packaging; Reflection; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550043
  • Filename
    4550043