DocumentCode
1946271
Title
Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects
Author
Choi, Yongjin ; Braunisch, Henning ; Aygun, Kemal ; Franzon, Paul D.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
fYear
2008
fDate
27-30 May 2008
Firstpage
664
Lastpage
668
Abstract
While the increasing demand for smaller packages and low-cost platforms aggressively drives the interconnect density per unit area, crosstalk noise due to capacitive and inductive coupling limits the achievable interconnect density. As an alternative, we investigate multimode signaling where n signals are transmitted by exciting all fundamental modes on a group of n closely coupled lines called a bundle. Even though crosstalk is ideally zero in a single bundle, practical implementation of this idea for a typical input/output (IO) bus requires multiple closely-placed bundles. Thus, inter-bundle crosstalk may be an issue. In this paper, we analyze the inter-bundle crosstalk starting with the analytical expressions for the modal conversion from one bundle to another. Frequency domain simulations for both frequency-dependent and frequency-independent terminations are performed to compare performance vs. density benefits of multi-bundle multi-mode interconnects to those provided by conventional single-ended and differential signaling.
Keywords
crosstalk; multiprocessor interconnection networks; signalling; crosstalk noise; frequency-dependent terminations; frequency-independent terminations; high-density interconnects; inductive coupling limits; input-output bus; interbundle crosstalk; modal conversion; multimode signaling; Bandwidth; Capacitance; Crosstalk; Decoding; Frequency domain analysis; Microprocessors; Multicore processing; Packaging; Reflection; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550043
Filename
4550043
Link To Document