Failure mechanisms of pressurized microchannels, model and experiments

Author

Blom, M.T. ; Tas, N.R. ; Pandraud, G. ; Chmela, E. ; Gardeniers, J.G.E. ; Tijssen, R. ; Elwenspoek, M. ; van den Berg, A.

Author_Institution

MESA Res. Inst., Twente Univ., Enschede, Netherlands

fYear

2000

fDate

23-27 Jan 2000

Firstpage

199

Lastpage

204

Abstract

Microchannels were created by fusion bonding of a Pyrex and a thermally oxidized silicon wafer. The maximum pressure which can be applied to these channels was investigated. In order to find the relation between this maximum pressure, channel geometry, material elasticity and bond energy, an energy model was developed. It was shown that the model is substantiated by the pressure data, from which it could be calculated that the effective bond energy increased from 0.018 J/m² to 0.19 J/m² for an annealing temperature ranging from 310°C to 470°C

Keywords

adhesion; annealing; elastic deformation; glass; high-pressure techniques; mechanical contact; microfluidics; semiconductor device models; silicon; surface energy; wafer bonding; 310 to 470 C; Pyrex wafer; Si; annealing temperature; bond energy; channel geometry; elastic adhesive contact model; elastic deformation energy; energy model; failure mechanisms; fusion bonding; high pressure microchannels; hydraulic energy; material elasticity; maximum pressure; pressurized microchannels; surface energy; thermally oxidized silicon wafer; total energy; work of adhesion; yield pressures; Annealing; Elasticity; Failure analysis; Geometry; Microchannel; Semiconductor device modeling; Silicon; Solid modeling; Temperature distribution; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838516

Filename

838516