Title :
Comparison and analysis of integrated passive device technologies for wireless radio frequency module
Author :
Kundu, Arun Chandra ; Megahed, Mohamed ; Schmidt, Dominik
Author_Institution :
Ultra Mobility Group, Intel Corp., Chandler, AZ
Abstract :
We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.
Keywords :
WiMax; radiofrequency integrated circuits; system-in-package; WiMAX; discrete radio frequency; integrated passive device; low-temperature cofired ceramic technology; system-in-package; wireless radio frequency module; Capacitance; Costs; Foot; Glass; Inductors; Integrated circuit technology; Packaging; Q factor; Radio frequency; Silicon;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550046
