DocumentCode
1946459
Title
New failure mechanism in silicon nitride resonators
Author
Kazinczi, R. ; Mollinger, J.R. ; Bossche, A.
Author_Institution
Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
fYear
2000
fDate
23-27 Jan 2000
Firstpage
229
Lastpage
234
Abstract
This study focuses on a new reliability problem of micromechanical structures based on thin silicon nitride films. Silicon nitride is used in numerous MEMS applications thanks to its good mechanical and electrical properties. The SiNx micromechanical structures usually serve as supporting elements such as membranes, plates and cantilevers. A new failure mechanism is found in thin resonating SiNx structures operating in air. The stiffness of the structure is changing due to surface oxidation. The surface oxide layer can crack and recover during operation of the device. This results in unstable resonance frequency and failure of the resonant mode MEMS device
Keywords
Young´s modulus; elastic moduli measurement; environmental degradation; failure analysis; insulating thin films; micromechanical resonators; oxidation; silicon compounds; surface chemistry; FEA; SiN; SiNx micromechanical structures; Young modulus; cantilevers; crack; failure mechanism; membranes; plates; resonant mode MEMS device; stiffness; surface oxidation; thin resonating structures; thin silicon nitride films; unstable resonance frequency; Biomembranes; Failure analysis; Mechanical factors; Micromechanical devices; Oxidation; Resonance; Resonant frequency; Semiconductor films; Silicon compounds; Surface cracks;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location
Miyazaki
ISSN
1084-6999
Print_ISBN
0-7803-5273-4
Type
conf
DOI
10.1109/MEMSYS.2000.838521
Filename
838521
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