• DocumentCode
    1946459
  • Title

    New failure mechanism in silicon nitride resonators

  • Author

    Kazinczi, R. ; Mollinger, J.R. ; Bossche, A.

  • Author_Institution
    Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
  • fYear
    2000
  • fDate
    23-27 Jan 2000
  • Firstpage
    229
  • Lastpage
    234
  • Abstract
    This study focuses on a new reliability problem of micromechanical structures based on thin silicon nitride films. Silicon nitride is used in numerous MEMS applications thanks to its good mechanical and electrical properties. The SiNx micromechanical structures usually serve as supporting elements such as membranes, plates and cantilevers. A new failure mechanism is found in thin resonating SiNx structures operating in air. The stiffness of the structure is changing due to surface oxidation. The surface oxide layer can crack and recover during operation of the device. This results in unstable resonance frequency and failure of the resonant mode MEMS device
  • Keywords
    Young´s modulus; elastic moduli measurement; environmental degradation; failure analysis; insulating thin films; micromechanical resonators; oxidation; silicon compounds; surface chemistry; FEA; SiN; SiNx micromechanical structures; Young modulus; cantilevers; crack; failure mechanism; membranes; plates; resonant mode MEMS device; stiffness; surface oxidation; thin resonating structures; thin silicon nitride films; unstable resonance frequency; Biomembranes; Failure analysis; Mechanical factors; Micromechanical devices; Oxidation; Resonance; Resonant frequency; Semiconductor films; Silicon compounds; Surface cracks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
  • Conference_Location
    Miyazaki
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5273-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2000.838521
  • Filename
    838521