Title :
New failure mechanism in silicon nitride resonators
Author :
Kazinczi, R. ; Mollinger, J.R. ; Bossche, A.
Author_Institution :
Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Abstract :
This study focuses on a new reliability problem of micromechanical structures based on thin silicon nitride films. Silicon nitride is used in numerous MEMS applications thanks to its good mechanical and electrical properties. The SiNx micromechanical structures usually serve as supporting elements such as membranes, plates and cantilevers. A new failure mechanism is found in thin resonating SiNx structures operating in air. The stiffness of the structure is changing due to surface oxidation. The surface oxide layer can crack and recover during operation of the device. This results in unstable resonance frequency and failure of the resonant mode MEMS device
Keywords :
Young´s modulus; elastic moduli measurement; environmental degradation; failure analysis; insulating thin films; micromechanical resonators; oxidation; silicon compounds; surface chemistry; FEA; SiN; SiNx micromechanical structures; Young modulus; cantilevers; crack; failure mechanism; membranes; plates; resonant mode MEMS device; stiffness; surface oxidation; thin resonating structures; thin silicon nitride films; unstable resonance frequency; Biomembranes; Failure analysis; Mechanical factors; Micromechanical devices; Oxidation; Resonance; Resonant frequency; Semiconductor films; Silicon compounds; Surface cracks;
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
Print_ISBN :
0-7803-5273-4
DOI :
10.1109/MEMSYS.2000.838521