Printed circuit assembly with no lead solder assembly process

In 1995, Nortel´s (Northern Telecom) Business Development-Environmental Affairs department reviewed the environmental issues of greatest concern to the electronics industry. As a result of this review, Nortel found that the lead (Pb) content of electronic products was one of the most important environmental concerns for the industry. Furthermore, Nortel realized that a program to eliminate lead would not only be good for the environment and public health concerns, but that it was also a task the company could have real control over (vis a vis suppliers), that it should be technologically feasible, and that it should decrease the life cycle costs of Nortel´s products. Thus, after a review of Nortel´s product portfolio a project to remove lead from the assembly of printed circuit boards was launched. This decision was further justified by on going research into lead-free alternative solders at Nortel´s Research and development facilities in the UK. Based on the results of an evaluation program of various lead-free solders, an Sn-Cu solder was chosen as being the most suitable for Nortel products