Void-free full wafer adhesive bonding

Author

Niklaus, Frank ; Enoksson, P. ; Kalvesten, E. ; Stemme, Goran

Author_Institution

Dept. of Signal, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden

fYear

2000

fDate

23-27 Jan. 2000

Firstpage

247

Lastpage

252

Abstract

In this paper we present guidelines for void free adhesive bonding of 10 cm diameter wafers. We have systematically investigated the influence of different bonding parameters on void formation in the bond. The layer thicknesses of the tested polymer coatings are between 1 /spl mu/m and 12 /spl mu/m. The polymer material, the bonding pressure and the pre-curing time and temperature for the polymer has shown significant influence on void formation in the bond. High bonding pressure and pre-curing times/temperatures that are specific to the polymer material counteract void formation. Process parameters for achieving void-free bonds using benzocyclobutene (BCB) and photoresist coatings as adhesive materials are given. Excellent bonding results have been achieved with BCB as bonding material.

Keywords

adhesion; micromechanical devices; organic compounds; polymer films; voids (solid); 1 to 12 mum; 10 cm; BCB; MEMS; adhesive bonding; benzocyclobutene; bonding pressure; layer thicknesses; photoresist coatings; polymer coatings; pre-curing temperature; pre-curing time; void formation; void-free bonds; Biomembranes; Guidelines; Integrated circuit technology; Joining materials; Polymers; Resists; Sealing materials; Sensor systems; Temperature; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki, Japan

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838524

Filename

838524