Batch transfer of LIGA microstructures by selective electroplating and bonding

Author

Pan, Li-Wei ; Lin, Liwei

Author_Institution

Dept. of Mech. Eng. & Appl. Mech., Michigan Univ., Ann Arbor, MI, USA

fYear

2000

fDate

23-27 Jan 2000

Firstpage

259

Lastpage

264

Abstract

A flip-chip, batch tranfer process for LIGA microstructures has been demonstrated be selected electroplating and bonding. The bonding process is achieved by filling electroplated nickel in the gap of two bonding substrates, a LIGA and an IC (Integrated Circuit) chip. The electroplating solution is set at a temperature of 50°C and with current density of 68.3 A/m². It is found that a total electroplating time of 80 minutes is required for the completion of the bonding process and that all the targeted LIGA microstructures are bonded and transferred to the IC substrate. Experimentally, a LIGA gripper based on the principle of self-heating and thermal expansion is successfully transferred and operated. When a maximum input current of 1.6 A is applied, a displacement of 90 μm is observed. This flip-chip assembly process enables a new class of integrated electro-mechanical manufacturing for microelectromechanical devices

Keywords

LIGA; adhesion; electroplating; flip-chip devices; micromechanical devices; 1.6 A; 50 C; 80 min; 90 mum; LIGA gripper; LIGA microstructures; Ni; batch tranfer process; bonding; electroplated Ni; electroplating time; flip-chip assembly; integrated electro-mechanical manufacturing; microelectromechanical devices; selective electroplating; self-heating; thermal expansion; Assembly; Bonding processes; Current density; Filling; Grippers; Manufacturing processes; Microstructure; Nickel; Temperature; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838526

Filename

838526