DocumentCode
1946993
Title
Influence of optical probe packaging on a 3D MEMS scanning micro-mirror for optical coherence tomography (OCT) applications
Author
Premachandran, C.S. ; Khairyanto, Ahmad ; Chen, Kelvin ; Singh, Jank ; Wang, Sandy XL ; Yingshun, Xu ; Nanguang, Chen ; Sheppard, C.J.R. ; Olivo, Malini ; Lau, John
Author_Institution
Inst. of Microelectron., A*STAR, Singapore
fYear
2008
fDate
27-30 May 2008
Firstpage
829
Lastpage
833
Abstract
An optical probe is developed for imaging in an optical coherence tomography (OCT) system. A 3D micro mirror is used for steering the beam from the source to the sample. A GRIN lens, fiber and micro mirror are assembled in a silicon optical bench. The assembled components are housed in the bio-compatible microinjection molded housing. The images obtained using this probe is studied with respect to probe assembly. Tolerance of GRIN lens placement, micro mirror placement on the substrate, deformation of the mirror, housing transparency and housing curvature are studied with respect to the final image from the probe. In this study it is found that a higher mirror curvature affects the depth of focus on the sample and mirror placement reduces the coupling efficiency during the optical assembly.
Keywords
biological techniques; gradient index optics; integrated optics; micro-optomechanical devices; microlenses; micromirrors; optical tomography; probes; 3D MEMS; GRIN lens; assembled components; bio-compatible microinjection molded housing; curvature; deformation; fiber; focus depth; optical coherence tomography system; optical probe packaging; scanning micro-mirror; silicon optical bench; transparency; Assembly; Biomedical optical imaging; Lenses; Micromechanical devices; Mirrors; Optical imaging; Packaging; Probes; Silicon; Tomography;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550072
Filename
4550072
Link To Document