• DocumentCode
    1947173
  • Title

    Intra-chip physical parameter sensor for FPGAS using flip-flop metastability

  • Author

    Tarawneh, Ghaith ; Mak, Terrence ; Yakovlev, Alex

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Newcastle Univ., Newcastle upon Tyne, UK
  • fYear
    2012
  • fDate
    29-31 Aug. 2012
  • Firstpage
    373
  • Lastpage
    379
  • Abstract
    We present a novel intra-chip physical parameter sensor that exploits the clock-to-q delay response of flip-flops. The proposed design relies on deliberately violating the setup and hold time conditions of a flip-flop to bring it into metastable states and increase its clock-to-q delay. Traditionally, this is an undesired effect because it can result in unpredictable system failures. In this work, this phenomenon is exploited to quantify variations in intra-chip physical parameters. Our design has three benefits over conventional ring-oscillator-based sensors; it consumes less device resources, has a higher precision and does not require a high clock frequency. We present a small-signal model of the proposed sensor and compare its performance with ring oscillators by conducting voltage and temperature-controlled experiments on an Altera Cyclone II FPGA device.
  • Keywords
    circuit stability; failure analysis; field programmable gate arrays; flip-flops; oscillators; sensors; Altera Cyclone II FPGA device; FPGA; clock-to-q delay response; conducting voltage; flip-flop metastability; high clock frequency; intrachip physical parameter sensor; ring-oscillator-based sensors; small-signal model; system failures; temperature-controlled experiments; Clocks; Delay; Field programmable gate arrays; Radiation detectors; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Field Programmable Logic and Applications (FPL), 2012 22nd International Conference on
  • Conference_Location
    Oslo
  • Print_ISBN
    978-1-4673-2257-7
  • Electronic_ISBN
    978-1-4673-2255-3
  • Type

    conf

  • DOI
    10.1109/FPL.2012.6339207
  • Filename
    6339207