Title :
MRAM and microprocessor system-in-package: technology stepping stone to advanced embedded devices
Author :
Trigas, Cynthia ; Doll, Stefan ; Kruecken, Joachim
Author_Institution :
FreeScale Semicond., Munich, Germany
Abstract :
It is important to learn how new technologies will perform prior to becoming an embedded system-on-chip. This is one of the rationales for stacked-die packages (system-in-package).A stacked die combination of MAC7111 32-bit microprocessor and magnetoresistive random access memory (MRAM) was built and evaluated for functionality. The setup was completed and verified the functionality of the stacked-die-in-package. The application was able to run various applications and an understanding between the designers on how to embed the new MRAM technology into the microcontroller next generation designs was gained.
Keywords :
embedded systems; integrated circuit packaging; magnetic storage; magnetoresistive devices; microprocessor chips; random-access storage; 32 bit; MRAM; embedded devices; embedded system-on-chip; magnetoresistive random access memory; microcontroller; microprocessor; stacked-die packages; system-in-package; Computer architecture; Design optimization; Flash memory; Microprocessors; Nonvolatile memory; Printed circuits; Prototypes; Random access memory; Semiconductor device packaging; Silicon;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358738
