“Green” dielectric implementation in RF modules

The explosion of portable consumer electronics and mobile communication applications has driven RF module design to encompass a wide range of package types and functions. At Skyworks, this diversified wireless product portfolio results in two distinct types of laminate module configurations. All multilayer laminate package substrates use 1/2/1 build up HDI technology. In addition to the electrical design and performance considerations, thermomechanical characteristics for module assembly and reliability, compliance with environmental directives and the ability to have multiple Printed Circuit Board (PCB) suppliers using the same design rules and materials with high capability, good turn around time and acceptable costs are all given. As wireless modules expand, the types and features of the substrates is growing much more diverse and making the most appropriate choice for the dielectric much more complex. The qualification of bromine-free "green" dielectrics using standard package reliability testing is only the tip of the iceberg regarding implementation. This paper discusses the practical aspects of "green" dielectric implementation in RF modules after the initial qualification is done.