DocumentCode
1947726
Title
Packaging and thermal management of high-power, slab-coupled optical waveguide laser arrays for beam combining
Author
Missaggia, Leo J. ; Huang, Robin K. ; Chann, Bien ; Swint, Reuel ; Donnelly, Joseph P. ; Sanchez, Antonio ; Turner, George W.
Author_Institution
Lincoln Lab., Massachusetts Inst. of Technol., Lexington, MA
fYear
2008
fDate
27-30 May 2008
Firstpage
998
Lastpage
1004
Abstract
Linear arrays of slab coupled optical waveguide lasers (SCOWL) are nearly ideally suited for beam combining of array elements. SCOWL array elements have very high brightness, low divergence, nearly-diffraction-limited optical output beams with Watt-level performance. Both wavelength beam combining (WBC) and coherent beam combining (CBC) of SCOWL array elements have been successfully demonstrated. In this presentation, the packaging techniques developed to ensure proper performance of SCOWL arrays will be described, with particular emphasis on the application to beam combining. Arrays up to 1.2 cm wide, containing 120 elements on 100-mum element-to-element pitch have been demonstrated and used for WBC experiments. Aggressive thermal management was required in order to ensure optimum CW performance of these arrays and to minimize thermal cross talk between array elements. Commercial high performance micro impingement coolers (MIC) were used to accomplish this task. A numerical thermal model was constructed and used to investigate the thermal performance for several alternative packaging schemes using the MIC coolers. Assembly procedures were also developed in order to promote uniform optical performance of SCOWL array elements. These techniques resulted in minimal contraction (~2 mum) and smile (~1 mum) of the laser bar during the packaging process, which were sufficiently small to have minimal impact on the resultant WBC beam quality. CBC of SCOWL arrays required the ability to adjust the phase of the individual array elements. Packaging providing both individual electrical addressability of SCOWL array elements and good thermal performance has been developed and demonstrated, allowing for phase control by current adjustment. Individually addressable, 10-element SCOWL arrays have been demonstrated with total uncombined output power levels of >10 W CW. Coherent combining of ~7 W CW of optical power has been demonstrated from these 10-element SCOWL arrays.
Keywords
optical modulation; semiconductor device packaging; semiconductor laser arrays; thermal management (packaging); waveguide lasers; beam combining; current adjustment; high-power waveguide laser arrays; micro impingement coolers; numerical thermal model; packaging; phase control; size 1.2 cm; slab-coupled optical waveguide lasers; thermal management; Laser beams; Microwave integrated circuits; Optical arrays; Optical beams; Optical variables control; Optical waveguides; Packaging; Phased arrays; Thermal management; Waveguide lasers; High power lasers; laser arrays; packaging; semiconductor lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550098
Filename
4550098
Link To Document