Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process

Author

Song, H. ; Oh, Y.S. ; Song, I.S. ; Kang, S.J. ; Choi, S.O. ; Kim, H.C. ; Ha, B.J. ; Baek, S.S. ; Song, C.M.

Author_Institution

Microsyst. Lab. S&C Sector, Samsung Adv. Inst. of Technol., Suwon, South Korea

fYear

2000

fDate

23-27 Jan 2000

Firstpage

520

Lastpage

524

Abstract

A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The de-coupled gyroscope which had four driving springs and two sensing springs was designed and fabricated. A new fabrication process which could realize a high aspect ratio and use a thick single crystalline silicon as a structure layer, was proposed. The vacuum environment for operating a vibratory gyroscope was accomplished with vacuum packaging at wafer level. The vacuum level of ambient pressure was about 150 mtorr. The resolution of the gyroscope was 0.013°/sec/Hz^1/2. The output nonlinearity was below 2% in ±100°/s full scale

Keywords

etching; gyroscopes; micromachining; microsensors; packaging; semiconductor technology; silicon; vibrations; 150 mtorr; Si; decoupled vertical gyroscope; driving springs; fabrication process; high aspect ratio structure; microgyroscope; sensing springs; thick single crystalline Si layer; vacuum packaged gyroscope; vibratory gyroscope; wafer level gyroscope; Crystallization; Electrodes; Fabrication; Frequency; Gyroscopes; Packaging; Silicon; Springs; Vacuum technology; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838571

Filename

838571