Title :
Rigorous Three-Dimensional Photolithography Simulation over Nonplanar Structures
Author :
Kirchauer, H. ; Selberherr, S.
Author_Institution :
Institute for Microelectronics, TU Vienna, Gusshausstrasse 27-29, A-1040 Vienna, Austria. E-mail kirchauer@iue.tuwien.ac.at
Abstract :
A rigorous three-dimensional simulation method for nonplanar substrate lithography is presented. The light propagation within the photoresist is calculated using the Maxwell equations. Our method relies on a Fourier expansion of the electromagnetic field and extends the two-dimensional differential method [1][2].
Keywords :
Electromagnetic coupling; Electromagnetic propagation; Geometry; Lithography; Maxwell equations; Microelectronics; Partial differential equations; Permittivity; Resists; Symmetric matrices;
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location :
Bologna, Italy
