• DocumentCode
    1948110
  • Title

    The development of argon arc brazing with Cu-based filler for ITER thermal anchor attachment

  • Author

    Sun, Z.C. ; Lee, P.Y. ; Pan, C.J. ; Hou, B.L. ; Han, S.L. ; Pei, Y.Y. ; Long, W.M.

  • Author_Institution
    Southwestern Inst. of Phys., Chengdu, China
  • fYear
    2011
  • fDate
    26-30 June 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Thermal anchor is the key components of ITER magnet supports to maintain the low temperature for the normal operation of superconducting coils. During the advanced research of ITER thermal anchor attachment, dozens of brazing filler and several kinds of brazing technique have been developed and investigated. Argon arc brazing with Cu-based filler was chosen as the principal method for the attachment of thermal anchor. The brazing temperature of Cu-based filler is over 1000°C,but heat input is relatively low for shallower heating depth of argon arc brazing. Lower heat input is good for the control of brazing deformation. It is no need to clean after brazing because for argon arc brazing there is no brazing flux used. The test result shows that Cu-based alloy have the best mechanical properties at both room temperature and 77K for high brazing temperature. Detail of argon arc brazing with Cu-based filler have been investigated in this article.
  • Keywords
    Tokamak devices; fusion reactor design; fusion reactor operation; plasma toroidal confinement; superconducting coils; superconducting magnets; Cu-based filler; ITER magnet; ITER thermal anchor; argon arc brazing; brazing deformation control; brazing flux; brazing technique; brazing temperature; heat input; heating depth; superconducting coils; Iron; Lead; Manganese; Nickel; Nitrogen; Silicon; Cu-based filler; ITER; argon arc brazing; thermal anchor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fusion Engineering (SOFE), 2011 IEEE/NPSS 24th Symposium on
  • Conference_Location
    Chicago, IL
  • ISSN
    1078-8891
  • Print_ISBN
    978-1-4577-0669-1
  • Electronic_ISBN
    1078-8891
  • Type

    conf

  • DOI
    10.1109/SOFE.2011.6052245
  • Filename
    6052245