Title :
Evaluation of high density liquid crystal polymer based flex interconnect for supporting greater than 1 TB/s of memory bandwidth
Author :
Kollipara, Ravi ; Li, Ming ; Yuan, Chuck ; Kusamitsu, Hideki ; Ito, Toshiyasu
Author_Institution :
Rambus, Inc., Los Altos, CA
Abstract :
An LCP flex based interconnect that significantly improves the interconnect density and supports data rates in the range of 10 to 16 Gbps is evaluated to enable future high bandwidth module based memory systems without requiring complex equalization techniques. A mating two-piece, low- profile, high density and small insertion force connector is developed for interfacing the flex to a flip-chip package. The 216 pin connector can support 72 differential pairs in a 6 times 12 array.
Keywords :
chip scale packaging; flexible electronics; flip-chip devices; integrated circuit interconnections; integrated memory circuits; liquid crystal polymers; modules; bit rate 10 Gbit/s to 16 Gbit/s; flex interconnect; flip-chip package; high-bandwidth module; high-density liquid crystal polymer; memory systems; pin connector; two-piece low- profile small insertion force connector; Bandwidth; Connectors; Crosstalk; Dielectric losses; Games; Graphics; Integrated circuit interconnections; Liquid crystal polymers; Packaging; Reflection;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550118
