Evaluation of high density liquid crystal polymer based flex interconnect for supporting greater than 1 TB/s of memory bandwidth

Author

Kollipara, Ravi ; Li, Ming ; Yuan, Chuck ; Kusamitsu, Hideki ; Ito, Toshiyasu

Author_Institution

Rambus, Inc., Los Altos, CA

fYear

2008

fDate

27-30 May 2008

Firstpage

1132

Lastpage

1138

Abstract

An LCP flex based interconnect that significantly improves the interconnect density and supports data rates in the range of 10 to 16 Gbps is evaluated to enable future high bandwidth module based memory systems without requiring complex equalization techniques. A mating two-piece, low- profile, high density and small insertion force connector is developed for interfacing the flex to a flip-chip package. The 216 pin connector can support 72 differential pairs in a 6 times 12 array.

Keywords

chip scale packaging; flexible electronics; flip-chip devices; integrated circuit interconnections; integrated memory circuits; liquid crystal polymers; modules; bit rate 10 Gbit/s to 16 Gbit/s; flex interconnect; flip-chip package; high-bandwidth module; high-density liquid crystal polymer; memory systems; pin connector; two-piece low- profile small insertion force connector; Bandwidth; Connectors; Crosstalk; Dielectric losses; Games; Graphics; Integrated circuit interconnections; Liquid crystal polymers; Packaging; Reflection;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550118

Filename

4550118