• DocumentCode
    1948403
  • Title

    Long throw and rotary output electro-thermal actuators based on bent-beam suspensions

  • Author

    Park, J.-S. ; Chu, L.L. ; Siwapornsathain, E. ; Olive, A.D. ; Gianchandani, Y.B.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
  • fYear
    2000
  • fDate
    23-27 Jan 2000
  • Firstpage
    680
  • Lastpage
    685
  • Abstract
    This paper reports on several aspects of the performance and application of bent-beam microactuators. Orthogonal pairs of p+ Si cascaded actuators with 500-1000 μm long, 6.5 μm thick beams designed for rotary drives are shown to produce 20-30 μm non-resonant displacement with >150 μN loading at less than 8 V, 300 mW. Inchworm type devices using 500-1500 μm long, 8-14 μm thick bent-beams are shown to produce up to 104 μm displacement against 204 μN loading farce with 250-750 mW DC and pulse actuation. Integrated passive locks reduce standby power to zero. Measured frequency response of bent-beam actuators and refinements in modeling that include non-linear thermal expansion coefficients and buckling are also reported
  • Keywords
    bending; buckling; etching; finite element analysis; frequency response; microactuators; micromachining; motor drives; moulding; semiconductor device models; thermal expansion; 250 to 750 mW; 500 to 1000 micron; 6.5 micron; FEA model; Joule heating; Si; actuator performance; bent-beam microactuators; bent-beam suspensions; design equations; electromechanical firewalls; electrothermal actuators; frequency response; inchworm type devices; integrated passive locks; long throw; modeling; mold stripping; nonlinear thermal expansion coefficients; nonresonant displacement; orthogonal pairs; p+ Si cascaded actuators; pulse actuation; reduced power dissipation; rotary drives; rotary output; vertical buckling; wet etching; Application software; Electrostatic actuators; Electrothermal effects; Equations; Laboratories; Mechanical engineering; Pneumatic actuators; Suspensions; Temperature; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
  • Conference_Location
    Miyazaki
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5273-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2000.838600
  • Filename
    838600