Title :
Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect
Author :
Bandyopadhyay, Tapobrata ; Mehrotra, Gaurav ; Iyer, Mahadevan K. ; Raj, P.M. ; Swaminathan, Madhavan ; Tummala, Rao R.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
Abstract :
This paper presents design and characterization of nano-Cu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized up to 40 GHz in packaging configurations such as chip-on-chip and chip-on-package.
Keywords :
copper; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; Cu; chip-on-chip; frequency 40 GHz; microwave design; microwave frequencies; packaging configurations; ultra-fine pitch chip-to-package interconnect; CMOS technology; Copper; Electronic equipment testing; Electronics packaging; Frequency; Parametric study; Parasitic capacitance; Semiconductor device measurement; System testing; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550134
