Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications

In this paper, a novel flexible electrically conductive adhesive (FECA) has been designed for electronic interconnect applications that require high flexibility at the interconnects, such as assembly and repair of flexible circuits on flexible substrates and connectors. The physical properties of the resulting FECAs such as the elastic moduli, glass transition temperatures, adhesion strength and electrical properties were characterized by differential scanning calorimetry (DSC), dynamic mechanical analyzer (DMA), thermomechanical analyzer (TMA), die shear tester and multimeter electrical measurement. A high performance FECA with tunable modulus, flowability, glass transition temperature, electrical conductivity and adhesion strength was developed for the next-generation large scale flexible flat panel displays applications.