DocumentCode
1948906
Title
Analysis and experiment of the hypervapotron mock-up for the EAST upgrade
Author
Wang, Z.W. ; Song, Y.T. ; Huang, S.H.
Author_Institution
Tokamak Design Div., Inst. of Plasma Phys., Hefei, China
fYear
2011
fDate
26-30 June 2011
Firstpage
1
Lastpage
4
Abstract
During the EAST upgrade, the peak heat flux applied on the first wall components will be 2 MW/m2, which requires powerful cooling concept to decrease the component temperature, in order to simplify the material requirement and armor/heat sink module design. Hypervapotron is a promising method for high heat transfer coefficient, which bases on sub cooling boiling phenomenon, and has the potential to support the demand in several years (up to 20 MW/m2 with strong armor), and is chosen to be a candidate. The design contains a copper heat sink and uses water as coolant, a series of CFD analyses are performed to optimize the design, and a mock-up based on this optimization is assembled on a high heat flux test facility which employs electromagnetic induction heating and high speed photography; during the experiment under the required working conditions, the flowing status and thermal parameters are recorded. The analysis and experiment confirm the performance of the hypervapotron concept and the feasibility of the use in the EAST upgrade project.
Keywords
Tokamak devices; computational fluid dynamics; fusion reactor design; fusion reactor materials; heat transfer; plasma toroidal confinement; plasma transport processes; CFD analyses; EAST upgrade; copper heat sink; electromagnetic induction heating; heat flux test facility; heat sink module design; heat transfer coefficient; high speed photography; hypervapotron mock-up; peak heat flux; plasma facing component; subcooling boiling phenomenon; tokamak; Computational fluid dynamics; Heating; Shape; Three dimensional displays; US Department of Defense; Welding; analysis; experiment; high heat flux; hypervapotron;
fLanguage
English
Publisher
ieee
Conference_Titel
Fusion Engineering (SOFE), 2011 IEEE/NPSS 24th Symposium on
Conference_Location
Chicago, IL
ISSN
1078-8891
Print_ISBN
978-1-4577-0669-1
Electronic_ISBN
1078-8891
Type
conf
DOI
10.1109/SOFE.2011.6052276
Filename
6052276
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