Title :
Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications
Author :
Jiang, Hongjin ; Moon, Kyoung-Sik ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
Abstract :
Chemical reduction methods were used to synthesize tin/silver/copper (SnAgCu) alloy nanoparticles with various sizes. The thermal properties of the SnAgCu alloy nanoparticles were studied by differential scanning calorimetry. Both the particle size dependent melting temperature and latent heat of fusion have been observed. The as-synthesized SnAgCu alloy nanoparticles were dispersed into an acidic type flux to form the nano solder pastes. Their wetting properties on the cleaned copper surface were studied. It was found that the nanoparticle pastes completely melted and wetted on the copper surface and the tin and copper intermetallic compounds formed. These low melting point SnAgCu alloy nanoparticles could be used for low temperature lead-free interconnect applications.
Keywords :
copper alloys; differential scanning calorimetry; heat of fusion; melting point; nanoparticles; particle size; reduction (chemical); silver alloys; solders; tin alloys; wetting; Cu; SnAgCu; chemical reduction methods; differential scanning calorimetry; heat of fusion; lead-free interconnect applications; melting temperature; particle size; solder; tin/silver/copper alloy nanoparticle pastes; wetting; Calorimetry; Chemicals; Copper alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Nanoparticles; Silver; Temperature dependence; Tin alloys;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550160
