Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications

Author

Jiang, Hongjin ; Moon, Kyoung-Sik ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA

fYear

2008

fDate

27-30 May 2008

Firstpage

1400

Lastpage

1404

Abstract

Chemical reduction methods were used to synthesize tin/silver/copper (SnAgCu) alloy nanoparticles with various sizes. The thermal properties of the SnAgCu alloy nanoparticles were studied by differential scanning calorimetry. Both the particle size dependent melting temperature and latent heat of fusion have been observed. The as-synthesized SnAgCu alloy nanoparticles were dispersed into an acidic type flux to form the nano solder pastes. Their wetting properties on the cleaned copper surface were studied. It was found that the nanoparticle pastes completely melted and wetted on the copper surface and the tin and copper intermetallic compounds formed. These low melting point SnAgCu alloy nanoparticles could be used for low temperature lead-free interconnect applications.

Keywords

copper alloys; differential scanning calorimetry; heat of fusion; melting point; nanoparticles; particle size; reduction (chemical); silver alloys; solders; tin alloys; wetting; Cu; SnAgCu; chemical reduction methods; differential scanning calorimetry; heat of fusion; lead-free interconnect applications; melting temperature; particle size; solder; tin/silver/copper alloy nanoparticle pastes; wetting; Calorimetry; Chemicals; Copper alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Nanoparticles; Silver; Temperature dependence; Tin alloys;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550160

Filename

4550160