DocumentCode
1949045
Title
Thermal imaging of skin changes on the feet of type II diabetics
Author
Ammer, K. ; Melnizky, P. ; Rathkolb, O. ; Ring, E.F.
Author_Institution
Thermal Physiol. Lab, Univ. of Glamorgan, Pontypridd, UK
Volume
3
fYear
2001
fDate
2001
Firstpage
2870
Abstract
Skin changes such as callosities and mycosis may be regarded as a risk factor for severe structural impairments including ulcers and osteomyelitis in patients suffering from diabetes. Increased temperature of the feet of diabetics is another frequent finding. We investigated the relationship between skin changes and areas of increased skin temperature recorded with an Infrared Scanner AGEMA 870. 76 patients who had type 2 diabetes longer than 5 years, were studied. A physical examination of their feet and nerve conduction tests were performed. Thermal images were taken from both legs in the anterior view, the foot from an anterior view and the soles. 230 sites of high temperature (hot spots) were detected on the thermal images of 75 soles. Toe deformities or deformity of the anterior foot arch, skin callosities, onychomycosis were not related to hot spots on the sole. We confirm that about half of type II diabetes patients present with increased temperatures of their feet. However, no relationship with skin changes and areas of elevated skin temperature could be established. Thermal imaging does not identify the common skin changes found in the feet of diabetics.
Keywords
biomedical optical imaging; biothermics; diseases; infrared imaging; skin; 5 y; anterior foot arch deformity; anterior view; callosities; feet skin changes; hot spots; increased skin temperature; legs; medical diagnostic imaging; mycosis; nerve conduction tests; osteomyelitis; severe structural impairments; sole; toe deformities; type II diabetics; ulcers; Diabetes; Foot; Knee; Leg; Nails; Performance evaluation; Skin; Temperature; Testing; Thermal factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2001. Proceedings of the 23rd Annual International Conference of the IEEE
ISSN
1094-687X
Print_ISBN
0-7803-7211-5
Type
conf
DOI
10.1109/IEMBS.2001.1017387
Filename
1017387
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