Title :
Vlsi Soi Fabrication by Simox Wafer Bonding(swb)
Author :
Tong, O.-Y. ; Gösele, U.
Author_Institution :
School of Engineering, Duke University, Durham, NC
Keywords :
Annealing; CMOS technology; Etching; Fabrication; Implants; Semiconductor films; Surface morphology; Temperature; Very large scale integration; Wafer bonding;
Conference_Titel :
SOI Conference, 1992. IEEE International
Conference_Location :
Ponte Vedra Beach, FL
Print_ISBN :
0-7803-7439-8
DOI :
10.1109/SOI.1992.664800
