DocumentCode
1949160
Title
Observations of the spontaneous growth of tin whiskers in various reliability conditions
Author
Han, Sung-Won ; Kim, Kyung-Seob ; Yu, Chung-Hee ; Osterman, Michael ; Pecht, Michael
Author_Institution
Center for Adv. Life Cycle Eng., Maryland Univ., College Park, MD
fYear
2008
fDate
27-30 May 2008
Firstpage
1484
Lastpage
1490
Abstract
This study evaluated the growth of tin whiskers on tin plated alloy 42 lead-frames and copper lead-frames stored in ambient conditions for 4 years, samples stored in ambient conditions after a post-bake treatment, and stored at 55plusmn1degC/85plusmn3% conditions for 3000 hours. Analysis was conducted to investigate the propensity and the mechanisms of growth.
Keywords
copper; crystal growth; lead alloys; reliability; tin alloys; whiskers (crystal); Cu; Pb; Sn; copper lead-frames; post-bake treatment; reliability conditions; spontaneous growth; time 3000 hour; time 4 year; tin plated alloy; tin whiskers; Compressive stress; Copper alloys; Internal stresses; Lead; Reliability engineering; Residual stresses; Shape; Surface morphology; Surface treatment; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550172
Filename
4550172
Link To Document