• DocumentCode
    1949172
  • Title

    Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate

  • Author

    Kato, Takahiko ; Akahoshi, Haruo ; Nakamura, Masato ; Hashimoto, Tomoaki ; Nishimura, Asao

  • Author_Institution
    Mater. Res. Lab., Hitachi
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1491
  • Lastpage
    1497
  • Abstract
    A stress measurement method using SnCu coating on an Alloy 42 substrate sample, which indicated non-linear sin2 Psi diagram for the coating under ordinary X-ray diffraction conditions was investigated. Diffraction profile versus 2thetas diagrams for peak indexes of (312), (501), (213), (600), (323), (541), and (631) obtained using an iso inclination method and a fixed Psi method using CuKalpha radiation showed clear peaks for some Psi angles. However, in other cases, the diagrams showed flat forms (no peaks). It was found that removing the Psi data with the flat forms from the diffraction profile versus 2thetas diagram gave a linear sin2Psi diagram for each index. Indexes with higher 2thetas degrees had a smaller confidence limit. The (631) peak with the highest 2thetas degree, which had no flat forms in the diffraction profile versus the 2thetas diagram, even with seventeen Psi data points, indicated a linear sin2thetas diagram and a confidence limit of less than plusmn2 MPa.
  • Keywords
    X-ray diffraction; copper alloys; electrodeposition; electrodeposits; internal stresses; phase diagrams; tin alloys; 2thetas diagrams; SnCu; X-ray diffraction; alloy substrate; electrodeposited coating; inclination method; nonlinear sin2 Psi diagram; stress; Coatings; Copper alloys; Electronic mail; Lead; Production engineering; Scanning electron microscopy; Stress measurement; Substrates; X-ray diffraction; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550173
  • Filename
    4550173