Digital noise coupling mechanisms in a 2.4 GHz LNA for heavily and lightly doped CMOS substrates

Author

Hazenboom, Scott ; Fiez, Terri ; Mayaram, Karti

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Oregon State Univ., Corvallis, OR, USA

fYear

2004

fDate

3-6 Oct. 2004

Firstpage

367

Lastpage

370

Abstract

In this paper the noise injected into a 2.4 GHz low noise amplifier (LNA) from a digital buffer is examined for both heavily and lightly doped CMOS substrates. The noise coupling is modeled in SPICE with good correlation between measurements and simulations. Using these models and simulations the major noise coupling mechanisms are identified providing insight into suitable noise mitigation approaches.

Keywords

CMOS integrated circuits; SPICE; UHF amplifiers; UHF integrated circuits; buffer circuits; circuit simulation; doping profiles; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; 2.4 GHz; CMOS measurements; CMOS simulations; LNA; SPICE; digital buffer; digital noise coupling mechanisms; heavily doped CMOS substrates; injected noise; lightly doped CMOS substrates; low noise amplifier; noise coupling mechanisms; noise coupling model; noise mitigation; CMOS logic circuits; Circuit noise; Circuit simulation; Coupling circuits; Low-noise amplifiers; Noise measurement; Optical coupling; Packaging; Radio frequency; SPICE;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004

Print_ISBN

0-7803-8495-4

Type

conf

DOI

10.1109/CICC.2004.1358824

Filename

1358824