DocumentCode :
1949455
Title :
Fracture mechanics study of fatigue crack growth in solder joints under drop impact
Author :
Wang, Jason ; Seah, S.K.W. ; Wong, E.H. ; Cadge, D.
Author_Institution :
WorleyParsons Pte. Ltd., Singapore
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
1601
Lastpage :
1605
Abstract :
This paper describes the use of a fracture mechanics-based modeling approach to explain two interesting experimental observations in solder joints subjected to high speed cyclic bending, namely 1) the evolution of the crack front from a positive to a negative curvature; and 2) the initial acceleration and the subsequent retardation of the crack growth rate. Two- dimensional crack fronts in the solder joint were modeled, and J-integral along the crack front was computed. The modeling results have provided physical insights into the experimentally observed crack growth phenomena.
Keywords :
bending; fatigue cracks; fracture mechanics; impact (mechanical); materials testing; solders; J-integral; crack growth rate; drop impact; fatigue crack growth; fracture mechanics; high speed cyclic bending; solder joints; Assembly; Capacitive sensors; Circuit testing; Fatigue; Frequency; Integrated circuit interconnections; Integrated circuit testing; Soldering; Strain measurement; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4550190
Filename :
4550190
Link To Document :
بازگشت