Title :
Designing a via-configurable regular fabric
Author :
Yajun Ran ; Marek-Sadowska, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
In this paper we present an architecture of a via-configurable regular fabric. The basic logic block is composed of via-configurable functional cells placed in a circular fashion along with a via-decomposable flip-flop. Segmented, prefabricated wires provide the intra-block and inter-block connections. All the interconnects can be customized using a set of programmable via masks. This architecture can achieve performance similar to that of standard-cell-based designs in a comparable area, but with greatly reduced mask cost.
Keywords :
application specific integrated circuits; flip-flops; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; logic design; logic testing; masks; programmable logic devices; basic logic block; inter-block connections; intra-block connections; mask cost; programmable via mask customized interconnects; segmented prefabricated wires; standard-cell- based designs; via-configurable functional cells; via-configurable regular fabric architecture; via-configurable regular fabric design; via-decomposable flip-flop; Costs; Electronics packaging; Fabrics; Flip-flops; Integrated circuit interconnections; Logic; Manufacturing; Switches; Table lookup; Wires;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358840
