Designing a via-configurable regular fabric

Author

Yajun Ran ; Marek-Sadowska, M.

Author_Institution

Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

fYear

2004

fDate

6-6 Oct. 2004

Firstpage

423

Lastpage

426

Abstract

In this paper we present an architecture of a via-configurable regular fabric. The basic logic block is composed of via-configurable functional cells placed in a circular fashion along with a via-decomposable flip-flop. Segmented, prefabricated wires provide the intra-block and inter-block connections. All the interconnects can be customized using a set of programmable via masks. This architecture can achieve performance similar to that of standard-cell-based designs in a comparable area, but with greatly reduced mask cost.

Keywords

application specific integrated circuits; flip-flops; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; logic design; logic testing; masks; programmable logic devices; basic logic block; inter-block connections; intra-block connections; mask cost; programmable via mask customized interconnects; segmented prefabricated wires; standard-cell- based designs; via-configurable functional cells; via-configurable regular fabric architecture; via-configurable regular fabric design; via-decomposable flip-flop; Costs; Electronics packaging; Fabrics; Flip-flops; Integrated circuit interconnections; Logic; Manufacturing; Switches; Table lookup; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004

Conference_Location

Orlando, FL, USA

Print_ISBN

0-7803-8495-4

Type

conf

DOI

10.1109/CICC.2004.1358840

Filename

1358840