• DocumentCode
    1949636
  • Title

    Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management

  • Author

    Kai, Zhang ; Yuen, Matthew M F ; Xiao, David G W ; Fu, Y.Y. ; Chan, Philip

  • Author_Institution
    Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1659
  • Lastpage
    1663
  • Abstract
    Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substrates by thermal chemical vapor deposition (CVD). Iron nitrate (Fe(NO3)3ldr9H2O) was used as the catalyst. Parameters influencing CNT synthesis were studied and optimized. Several surface treatment methods were proposed to improve the quality of CNTs synthesized on aluminum alloy substrates. The grown CNT arrays were used as thermal interface material (TIM) while the aluminum alloy substrate used as the heat sink in high brightness LED packages. The measured thermal resistance of the grown CNT-TIM was 38 mm2-K/W. The output light power testing demonstrated CNT-TIM is an attractive thermal management solution for HB- LED packages.
  • Keywords
    carbon nanotubes; chemical vapour deposition; heat sinks; nanotechnology; surface treatment; thermal management (packaging); thermal resistance; C; aluminum alloy substrates; catalyst; heat sink; high brightness LED packages; output light power testing; surface treatment; thermal chemical vapor deposition; thermal interface material; thermal management; thermal resistance; vertically aligned carbon nanotube arrays; Aluminum alloys; Carbon nanotubes; Chemical vapor deposition; Heat sinks; Iron; Light emitting diodes; Packaging; Surface resistance; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550200
  • Filename
    4550200