Title :
Helically bent structure of straight optical waveguide for flexible optical interconnection
Author :
Lee, Woo-Jin ; Hwang, Sung Hwan ; Lim, Jung Woon ; Rho, Byung Sup
Author_Institution :
Integrated Opt. Module Lab., Korea Photonics Technol. Inst., Gwangju
Abstract :
We fabricated straight multimode optical waveguide films to analyze quantitatively the effectiveness of the helical bending. The optical waveguide films were very flexible and the refractive index difference between the core and the clad was 1.53% at a wavelength of 0.85 mum. This paper focuses on the helical bending losses under a proper index difference. Therefore, we measured first the bending losses with various bending radiuses and then the helical bending losses with various inclined angles and the radiuses, sequentially. As a result, we could improve the bending loss by 4 dB at 60deg- inclined angle and 1 mm radius, compared to a normal bending structure. In addition, we fabricated a flexible optical interconnection module linked with the flexible optical waveguide to investigate how the helical bending has an effect on data transmission. The optical interconnection module was composed of vertical cavity surface emitting laser, photodiode, and a 45deg-ended waveguide. The helical bending was applied to the waveguide of the optical interconnection module and data transmission characteristics with the inclined angles were measured.
Keywords :
bending; optical interconnections; optical waveguides; refractive index; data transmission; flexible optical interconnection; helical bending; helically bent structure; optical waveguide; refractive index; Data communication; Loss measurement; Optical films; Optical interconnections; Optical losses; Optical refraction; Optical variables control; Optical waveguides; Refractive index; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550208