Design of integrated systems including MEMS and ASICs

Author

Gilbert, John R. ; Bart, Stephen F. ; Romanowicz, Bart F.

Author_Institution

Microcosm Technol. Inc., USA

fYear

1998

fDate

13-16 Sep 1998

Firstpage

383

Lastpage

386

Abstract

Design of products containing MEMS/MST subsystems requires a top-down approach to system design. We present a methodology to support the subsystem designers with behavioral models and simulation tools, which enable the specification of subsystem functions at the level of the system architect. 3-D multi-physics simulations are used to create the computationally efficient models required for system level simulations. The design methodology described here facilitates effective communication between the subsystem designers

Keywords

application specific integrated circuits; concurrent engineering; digital simulation; integrated circuit design; micromechanical devices; packaging; 3D multi-physics simulations; ASICs; MEMS; MST subsystems; behavioral models; computationally efficient models; integrated systems; simulation tools; system level simulations; top-down approach; Analog integrated circuits; Application specific integrated circuits; Communication effectiveness; Computational modeling; Concurrent engineering; Design methodology; Microelectromechanical devices; Micromechanical devices; Packaging; Product design;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference 1998. Proceedings. Eleventh Annual IEEE International

Conference_Location

Rochester, NY

ISSN

1063-0988

Print_ISBN

0-7803-4980-6

Type

conf

DOI

10.1109/ASIC.1998.723044

Filename

723044