Title :
Full-chip vectorless dynamic power integrity analysis and verification against 100uV/100ps-resolution measurement
Author :
Lin, Shen ; Nagata, Makoto ; Shimazake, K. ; Satoh, Kazuhiro ; Sumita, Masaya ; Tsujikawa, Hiroyuki ; Yang, Andrew T.
Author_Institution :
Apache Design Solutions Inc., Mountain View, CA, USA
Abstract :
The advances in semiconductor manufacturing, EDA tools, and VLSI design technologies are enabling circuit designs with increasingly higher speed and density. However, this trend is causing the on-chip power distribution network to experience larger dynamic voltage fluctuations due to dynamic voltage drop, L di/dt noise, and/or LC resonance. As a result, the analysis of power-integrity, as well as the evaluation and calibration of the analysis methodology, has become a major challenge in designing high-performance circuits. An innovative vectorless dynamic power-ground noise analysis approach is discussed in this paper. This approach addresses full-chip complexity with transistor-level accuracy. This analysis approach demonstrated very good correlation with an on-chip supply noise measurement in 0.13-μm CMOS technology, capable of achieving 100 μV/100 ps resolution.
Keywords :
CMOS integrated circuits; circuit simulation; electric noise measurement; integrated circuit design; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; transient analysis; 0.13 micron; 100 muV; 100 ps; CMOS noise measurement; LC resonance; dynamic voltage drop; dynamic voltage fluctuations; full-chip transient simulation; noise measurement resolution; on-chip power distribution network; power integrity verification; power-ground noise analysis; vectorless dynamic power integrity analysis; CMOS technology; Circuit noise; Circuit synthesis; Electronic design automation and methodology; Network-on-a-chip; Power measurement; Power systems; Semiconductor device manufacture; Semiconductor device noise; Very large scale integration;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358869