• DocumentCode
    1950460
  • Title

    Embedded capacitor technology: A real world example

  • Author

    Smith, Norm ; Fan, Jun ; Andresakis, John ; Fukawa, Yoshi ; Harvey, Mark ; Knighten, Jim

  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1919
  • Lastpage
    1925
  • Abstract
    Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of embedded capacitor layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs.
  • Keywords
    capacitors; printed circuits; surface mount technology; embedded capacitor technology; power distribution system; printed circuit board; surface mount technology chip decoupling capacitors; test vehicles; Capacitance; Capacitors; Circuit testing; Power distribution; Predictive models; Printed circuits; Resonance; Surface-mount technology; System testing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550244
  • Filename
    4550244