DocumentCode
1950460
Title
Embedded capacitor technology: A real world example
Author
Smith, Norm ; Fan, Jun ; Andresakis, John ; Fukawa, Yoshi ; Harvey, Mark ; Knighten, Jim
fYear
2008
fDate
27-30 May 2008
Firstpage
1919
Lastpage
1925
Abstract
Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of embedded capacitor layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs.
Keywords
capacitors; printed circuits; surface mount technology; embedded capacitor technology; power distribution system; printed circuit board; surface mount technology chip decoupling capacitors; test vehicles; Capacitance; Capacitors; Circuit testing; Power distribution; Predictive models; Printed circuits; Resonance; Surface-mount technology; System testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550244
Filename
4550244
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