DocumentCode
1950475
Title
Enhancement of light efficiency of LED using a novel high refractive encapsulant
Author
Li, Hsun-Tien ; Hsu, Chia-Wen ; Chen, Kai-Chi
Author_Institution
Ind. Technol. Res. Inst., Hsinchu
fYear
2008
fDate
27-30 May 2008
Firstpage
1926
Lastpage
1930
Abstract
In this study, we conversed Bisbromomethyl-biphenyl and thiourea to a new biphenyl dithiol (BPDT) and used it as a co-curing agent. Its structure was confirmed by means of FT- IR, 1H-NMR, and MS spectra. We co-cured the conventional diglycidyl ether of Bisphenol A (DGEBA) epoxy resin with BPDT and aliphatic tetra-thiol (Pentaerythritol tetrakis(3- mercaptopropionate)) to get a colorless encapuslant (HRIL). After 80deg.C/2hour and 120deg.C/2hour curing process, the optical properties of the cured HRIL were measured. The refractive index was 1.64 which is the highest refractive index among the current existed LED encapsulant, and the transmittance of the cured HRIL was above 85% on the visible wavelength. Furthermore, the effect on light efficiency of LED was evaluated and found that the light efficiency of HRIL encapsulated LED was promoted 14%, compared with the conventional epoxy encapsulated LED. This result certainly reveals that the high refractive index encapslant can effectively enhance the light efficiency of LED. We also analyzed the thermal mechanical property and thermal stability of the cured HRIL which contained a hindered amine light stabilizer (HALS) by TMA and TGA. The Tg of the cured HRIL was 85.2deg.C and the thermal decomposed temperature was 327.7deg.C. After HOdeg.C/lOOOhour thermal aging test, the decrease of transmittance was less than 5% and the thermal resistant result unveils that the novel high refractive index encapsulant is suitable for high performance LED applications.
Keywords
Fourier transform spectra; ageing; infrared spectra; light emitting diodes; nuclear magnetic resonance; organic compounds; refractive index; thermal analysis; thermal stability; 1H-NMR spectra; DGEBA epoxy resin; FT-IR spectra; LED; TGA; aliphatic tetra-thiol; biphenyl dithiol; bisbromomethyl-biphenyl; co-curing agent; colorless encapuslant; diglycidyl ether of Bisphenol A; epoxy encapsulated LED; hindered amine light stabilizer; light efficiency; novel high refractive encapsulant; pentaerythritol tetrakis(3- mercaptopropionate); refractive index; thermal aging; thermal stability; thiourea; visible wavelength; Curing; Epoxy resins; Light emitting diodes; Mechanical factors; Optical refraction; Optical variables control; Refractive index; Stability analysis; Thermal resistance; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550245
Filename
4550245
Link To Document