DocumentCode
1950800
Title
Ceramic packaging reliability study of a 13.5 kV multichip thyristor
Author
Vergne, B. ; Gauthier-Blum, C. ; Brommer, V. ; Scharnholz, S. ; Spahn, E. ; Welleman, A.
Author_Institution
French-German Res. Inst. of St.-Louis (ISL), St. Louis, France
fYear
2011
fDate
19-23 June 2011
Firstpage
1128
Lastpage
1131
Abstract
We present our work on the reliability of the new ceramic housing of our 13.5 kV multichip thyristor. First ceramic versions manifested terrible failure after only a few shots under a bias voltage of 10 kV and a peak current of 110 kA in the best case. This problem has been solved and the newer ceramic-housing version is now fully commercialized under the model number 5SPB36Z1350. This product version completes successfully a stress test of 200 shots under previous conditions without failing. Moreover, no aging behavior has been detected.
Keywords
ceramic packaging; reliability; thyristors; ceramic housing; ceramic packaging reliability; current 110 kA; model number 5SPB36Z1350; multichip thyristor; stress test; voltage 10 kV; voltage 13.5 kV; Switches; Thyristors; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference (PPC), 2011 IEEE
Conference_Location
Chicago, IL
ISSN
2158-4915
Print_ISBN
978-1-4577-0629-5
Type
conf
DOI
10.1109/PPC.2011.6191657
Filename
6191657
Link To Document