Title :
The development of Anisotropic Conductive Paste (ACP) to make solder metal connection
Author :
Kawamoto, Satomi ; Matsumura, Kaori ; Abe, Yukinari
Author_Institution :
NAMICS Corp., Niigata
Abstract :
This paper presents the development of the effect of diameter and loading level of solder for connectivity and insulation, in addition we compared to Advanced ACP and conventional ACP, NCP. At first, alloy connection was confirmed using ACP with solder particle. The Chip was torn off after bonding, we confirmed melting solder at the surface of Bump and Pad. Solder alloy layer was confirmed between Bump and Pad by observation of cross-section. As these results, we concluded that the alloy layer could be formed due to the intervention of the solder.
Keywords :
adhesives; bonding processes; solders; alloy connection; anisotropic conductive paste; bonding process; bump surface; insulation; solder alloy layer; solder loading level; solder metal connection; solder particles; Anisotropic magnetoresistance; Assembly; Bonding; Cellular phones; Flip chip; Insulation; Semiconductor device packaging; Semiconductor materials; Substrates; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550266
