DocumentCode
1950859
Title
The development of Anisotropic Conductive Paste (ACP) to make solder metal connection
Author
Kawamoto, Satomi ; Matsumura, Kaori ; Abe, Yukinari
Author_Institution
NAMICS Corp., Niigata
fYear
2008
fDate
27-30 May 2008
Firstpage
2051
Lastpage
2055
Abstract
This paper presents the development of the effect of diameter and loading level of solder for connectivity and insulation, in addition we compared to Advanced ACP and conventional ACP, NCP. At first, alloy connection was confirmed using ACP with solder particle. The Chip was torn off after bonding, we confirmed melting solder at the surface of Bump and Pad. Solder alloy layer was confirmed between Bump and Pad by observation of cross-section. As these results, we concluded that the alloy layer could be formed due to the intervention of the solder.
Keywords
adhesives; bonding processes; solders; alloy connection; anisotropic conductive paste; bonding process; bump surface; insulation; solder alloy layer; solder loading level; solder metal connection; solder particles; Anisotropic magnetoresistance; Assembly; Bonding; Cellular phones; Flip chip; Insulation; Semiconductor device packaging; Semiconductor materials; Substrates; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550266
Filename
4550266
Link To Document