Ultra high Q embedded inductors in highly miniaturized family of low loss organic substrates

This paper presents the design, fabrication and measurement of high Q miniaturized inductors on a new family of ultra thin organic substrates. This paper for the first time discusses the design and fabrication of embedding ultra miniaturized RF inductors in ultra thin (100 - 150 microns thickness) organic substrates. The substrate described in this paper belongs to a new family of ultra low profile organic laminates with a loss tangent of about 0.0034 - 0.0045 and a dielectric constant of 3.4. Innovative inductor designs on this ultra thin substrate resulted in unloaded quality factors of about 100 - 150 in the frequency range of 1- 15 GHz and have line widths in the range of 2 - 4 mils and occupying an area of 0.062 - 0.64 mm². Design optimization, modeling and simulations performed are discussed in detail. Two test vehicles - test vehicle 1 (TV1) made up of two metal layers, having a thickness of 100 microns and test vehicle 2 (TV2), consisting of four metal layers and 150 microns in thickness have been used for the design of these inductors.