High performance organic dielectrics and high density substrates for next generation System on a Package (SOP) technology

Author

Krishnan, Ganesh ; Liu, Fuhan ; Sundaram, Venky ; Pucha, Raghuram ; Kennedy, Scott ; Baars, Dirk ; Dobrick, John ; Guo, David ; Neill, Jack ; Paul, Sankar ; Tummala, Rao

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA

fYear

2008

fDate

27-30 May 2008

Firstpage

2101

Lastpage

2104

Abstract

This paper introduces a new developmental family of thin film dielectric materials that have low dielectric constant (2.5 - 3.1 ) and low loss tangent (<0.005) at 10 GHz and discusses process development and reliability testing of a 1-2-1 substrate stack-up with versions of these high-performance developmental dielectrics (RXP-4). The variant used in these experiments is called RXP-4a. Various conditions were tried to optimize processing and reliability. Fine line structures down to 14 mum have been demonstrated. These were also found to pass reliability testing. Additionally, FE modeling was performed to understand the predicted reliability of microvias in these RXP-4 materials.

Keywords

dielectric materials; reliability; substrates; system-in-package; RXP-4a materials; fine line structures; high density substrates; next generation system on a package; organic dielectrics; reliability; thin film dielectric materials; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric substrates; Dielectric thin films; Iron; Materials reliability; Materials testing; Packaging; Predictive models;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550275

Filename

4550275