Factors influencing the design of microsystems

Author

Spangler, Leland Chip

Author_Institution

Aspen Technol., Colorado Springs, CO, USA

fYear

2004

fDate

3-6 Oct. 2004

Firstpage

687

Lastpage

691

Abstract

The engineering challenges of bringing microsystems products to market are substantially more broad than with conventional microelectronics. Harsh operating conditions and nonstandard materials result in effects not typically of concern for IC designers. Furthermore, supply, process and temperature variations can create significant issues with device performance. This paper provides an overview of microsystem devices and discusses ways some of these effects can be minimized or compensated for.

Keywords

calibration; compensation; electronics packaging; microactuators; microassembling; microsensors; signal processing equipment; transducers; MEMS; calibration; compensation; electronic actuators; electronic sensors; energy transformation devices; harsh operating conditions; microsystem interface circuits; microsystems design factors; package assembly; packaging; process variations; supply variations; temperature variations; transducer elements; transducers; wafer-based microelectronic fabrication processes; Biological materials; Circuits; Consumer electronics; Fabrication; Mechanical sensors; Microelectronics; Optical materials; Packaging; Temperature sensors; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004

Print_ISBN

0-7803-8495-4

Type

conf

DOI

10.1109/CICC.2004.1358920

Filename

1358920