DocumentCode
1951204
Title
Simple and accurate modeling of double-gate FinFET fin body variations
Author
Kim, Dongil ; Kang, Yesung ; Kim, Youngmin
Author_Institution
Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol. (UNIST), Ulsan, South Korea
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
265
Lastpage
268
Abstract
This paper presents a simple and accurate model for determining Ion and Ioff of a double-gate FinFET with varying gate fin shapes. Simulations show that gate fin shape variation results in significant changes in the leakage and driving capability of the device. We perform TCAD simulations of double-gate FinFET structures in order to analyze the effect of the gate fin body thickness (Tsi) variation on the electrical properties of the device. The thicknesses of the source and drain side are found to have different effects on the device. A simple model is proposed using the threshold voltage change due to the thickness variation along the gate fin. Simulation results show that the models match well with Ion and Ioff within 1.3% and 4.8% errors, respectively. In addition, we propose an optimal fin body shape to reduce the leakage current while providing a similar driving current to that in the nominal FinFET.
Keywords
MOSFET; leakage currents; semiconductor device models; TCAD simulations; double-gate FinFET fin body variations; double-gate FinFET structures; electrical properties; gate fin body thickness; gate fin shape variation; leakage current reduction; optimal fin body shape; threshold voltage; Equations; FinFETs; Integrated circuit modeling; Logic gates; Mathematical model; Shape; Threshold voltage; DFM; FinFET; gate fin; leakage; optimal shaping; performance; variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
Conference_Location
Seville
Print_ISBN
978-1-4673-0685-0
Type
conf
DOI
10.1109/SMACD.2012.6339390
Filename
6339390
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