• DocumentCode
    1951352
  • Title

    Handling and assembly of functionally adapted microcomponents

  • Author

    Chatzitheodoridis, E. ; Popovic, G. ; Brenner, W. ; Detter, W.

  • Author_Institution
    Inst. fur Feinwerktech., Tech. Univ. Wien, Austria
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    577
  • Abstract
    HAFAM (Handling and Assembly of Functionally Adapted Microcomponents) is a network in Training and Mobility of Researchers Programme (TMR), which is the continuation of the Human Capital and Mobility (HCM) Programme of the European Commission. This paper, describes the progress of the project after 17 months of operation. The objectives are briefly mentioned, and the training effect and the implications to industry are described. Also, some of the project´s scientific highlights are presented
  • Keywords
    micromechanical devices; European Commission; Handling and Assembly of Functionally Adapted Microcomponents; Human Capital and Mobility Programme; Training and Mobility of Researchers Programme; Assembly systems; Encapsulation; Europe; Humans; Industrial training; Micromechanical devices; Optical device fabrication; Packaging; Production; Research and development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2000. Proceedings. 2000 22nd International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    0-7803-5235-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.2000.838757
  • Filename
    838757